Systems for improved heat exchanger

ABSTRACT

According to some embodiments, systems for an improved heat exchanger may be provided. In some embodiments, a heat exchanger may comprise a core defining a cavity, a plurality of fins extending outwardly from the core, and an element disposed within the cavity of the core, wherein the element is to direct fluid within the cavity.

BACKGROUND

Electrical devices, such as computers, are comprised of multipleelectrical components (e.g., processors, voltage regulators, and/ormemory devices). Electrical components typically dissipate unusedelectrical energy as heat, which may damage the electrical componentsand/or their surroundings (e.g., other electrical components and/orstructural devices such as casings, housings, and/or electricalinterconnects). Various means, such as heat sinks and heat pipes, havebeen utilized to control and/or remove heat from electrical componentsand their surroundings.

As electrical devices, such as Personal Computer (PC) devices and evencomputer servers, are reduced in size however, space and costconstraints become limiting design factors. Typical heat mitigationdevices, for example, take up considerable amounts of room withinelectrical devices and/or include expensive components. As electricaldevices increase in processing speed and power, their components willgenerate even more heat that must be removed. Typical heat mitigationdevices may not be suitable for removing adequate amounts of heat fromelectrical components, particularly where space and cost are concerns.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a system.

FIG. 2 is a cross-sectional diagram of a heat exchanger according tosome embodiments.

FIG. 3 is a perspective diagram of a heat exchanger according to someembodiments.

FIG. 4 is a cross-sectional diagram of a system according to someembodiments.

FIG. 5 is a perspective diagram of a cold plate according to someembodiments.

FIG. 6 is a perspective diagram of an impeller according to someembodiments.

FIG. 7 is a cross-sectional diagram of a cooling system according tosome embodiments.

FIG. 8 is a block diagram of a system according to some embodiments.

DETAILED DESCRIPTION

Referring first to FIG. 1, a block diagram of a system 100 is shown. Thevarious systems described herein are depicted for use in explanation,but not limitation, of described embodiments. Different types, layouts,quantities, and configurations of any of the systems described hereinmay be used without deviating from the scope of some embodiments. Feweror more components than are shown in relation to the systems describedherein may be utilized without deviating from some embodiments.

The system 100 may comprise, for example, an electronic device 102 (suchas a processor, memory device, a voltage regulator, etc.), a cold plate110, a heat exchanger 120, a reservoir 148, a pump 150, and/or a fan180. In some configurations, the electronic device 102 may generate heatand/or may transfer heat to the cold plate 110. The cold plate 110 may,for example, be coupled to the electronic device 102 to accept and/orremove heat from the electronic device 102. Heat may travel throughconduction, in some configurations, from the electronic device 102 tothe cold plate 110 (e.g., as depicted via the wavy lines in FIG. 1).

In some configurations, the cold plate 110 may transfer heat to the heatexchanger 120. The heat exchanger 120 may, for example, be a heat sinkand/or radiator configured to expel and/or dissipate heat. In the casethat the heat exchanger 120 comprises fins (not shown in FIG. 1) fordissipating heat, for example, the fan 180 may facilitate the removaland/or dissipation of heat from the heat exchanger 120. The fan 180 may,in some configurations, direct air toward the heat exchanger 120 (and/orany fins thereof) to facilitate forced convection to remove heat fromthe heat exchanger 120. The system 100 may also or alternativelycomprise the pump 150. The pump 150 may, according to someconfigurations, circulate a fluid within the system 100.

For example, the heat transferred by the electronic device 102 to thecold plate 110 may be directed to and/or transferred to (e.g., conductedto) a fluid (such as water) that circulates through the cold plate 110.The heated fluid may then, for example, proceed to the heat exchanger120 to transfer heat to the heat exchanger 120 and/or to otherwisedissipate the heat within the fluid. The heat exchanger 120 may, forexample, remove heat from the fluid. The cooled fluid (e.g., cooledrelative to the heated fluid and/or the cold plate 110) may then proceedto the reservoir 148. The reservoir 148 may, for example, store aquantity of the fluid for use in the system 100. The fluid may then, forexample, circulate through the pump 150 (e.g., a centrifugal pump)and/or be drawn from the reservoir 148 by the pump 150. The fluid maythen proceed (and/or be directed) back to the cold plate 110 to removemore heat from the cold plate 110 (e.g., by allowing heat to transferfrom the cold plate 110 into the cooled fluid).

Turning to FIG. 2, a cross-sectional diagram of a heat exchanger 220according to some embodiments is shown. In some embodiments, the heatexchanger 220 may be similar to the heat exchanger 120 described inconjunction with FIG. 1. The heat exchanger 220 may, for example, beconfigured to remove, transfer, and/or dissipate (e.g., radiate) heat.In some embodiments, fewer or more components than are shown in FIG. 2may be included in the heat exchanger 220. In some embodiments, the heatexchanger 220 may comprise a core 222. In some embodiments, the heatexchanger 220 may comprise one or more fins 224 extending outwardly fromthe core 222. The fins 224 may, for example, be configured to dissipateand/or conduct heat from the core 222. The core 222, according to someembodiments, may define a cavity 226. As shown in FIG. 2, for example, across-sectional view of the heat exchanger 220 shows the core 222 in anannular and/or hollow cylindrical configuration defining the cavity 226.The core 222 (and/or the fins 224) may, for example, comprise a low-costaluminum hollow form extrusion.

According to some embodiments, the heat exchanger 220 may accept heatfrom within the cavity 226 of the core 222. A fluid may be circulatedwithin the cavity 226, for example, to transfer and/or conduct heat tothe heat exchanger 220. In some embodiments, the heat exchanger 220 maycomprise a first end cap 228 coupled to the core 222 to retain the fluidwithin the cavity 226. According to some embodiments, a hydraulic and/orhermetic seal may be formed between the core 222 and the first end cap228. In such a manner, for example, fluid circulating within the cavity226 of the core 222 may be substantially prohibited from leaking fromthe left side of the heat exchanger 220 (e.g., as oriented in FIG. 2),and/or air may be substantially prevented from entering the fluid flowwithin the cavity 226 (e.g., from outside of the heat exchanger 220).

In some embodiments, the heat exchanger 220 may also or alternativelycomprise a second end cap 230. The second end cap 230 may, for example,be coupled to the core 222 to substantially prevent the fluid fromleaking from the right side of the heat exchanger 220 (and/or tosubstantially prevent air from entering the cavity 226). In someembodiments, the second end cap 230 may be configured to provide,receive, evacuate, and/or otherwise transport the fluid. For example,the second end cap 230 may comprise an inlet 232 and/or an outlet 234.The inlet 232 and/or the outlet 234 may, according to some embodiments,be or include a fluid path (e.g., a conduit and/or a channel) to receiveand/or evacuate the fluid, respectively. The fluid may be received viathe inlet 232, for example, in a heated state, be cooled by the heatexchanger 220 (i.e., it may transfer heat to the heat exchanger 220),and be evacuated via the outlet 234 in a cooled state. In someembodiments, the inlet 232 and/or the outlet 234 may be configuredand/or oriented any manner that is or becomes known or practicable. Asshown in FIG. 2, for example, the inlet 232 and/or the outlet 234 may beconfigured to transport the fluid to and/or from particular and/orspecific areas within the cavity 226 of the core 222. In someembodiments, fluid may enter and/or be evacuated from either or bothends of the heat exchanger 220. The heat exchanger 220 may, for example,be connected in parallel and/or in series to any number of other devicessuch as other heat exchangers 220.

In some embodiments, the coupling of the first end cap 228 and/or thesecond end cap 230 to the core 222 may be conducted in any manner thatis or becomes known or practicable. For example, a first O-ring 236 maybe disposed between the first end cap 228 and the core 222 and/or asecond O-ring 238 may be disposed between the second end cap 230 and thecore 222. The O-rings 236, 238 may, according to some embodiments,facilitate the creation of a hydraulic and/or hermetic seal between thecore 222 and the end caps 228, 230. In some embodiments, the end caps228, 230 may be configured to accept the O-rings 236, 238 to provide animproved seal. The end caps 228, 230 may, for example, comprise anynumber of grooves, detents, threads, lips, seats, and/or other featuresthat facilitate coupling to the core 222 and/or creation of a hydraulicand/or hermetic seal (e.g., to substantially prevent fluid from leakingfrom the cavity 226 and/or to substantially prevent air frominfiltrating the cavity 226).

According to some embodiments, the heat exchanger 220 may also oralternatively comprise an element 240 disposed within the cavity 226 ofthe core 222. The element 240 may, for example, be configured totransport and/or direct the fluid within the cavity 226 of the core 222.The element 240 may also or alternatively facilitate retention of thefluid within the heat exchanger 220 and/or sealing of the cavity 226. Insome embodiments, the element 240 may comprise one or more grooves 242(and/or other features). The grooves 242 may, for example, define one ormore channels via which the fluid may be transported and/or directedwithin the cavity 226 of the core 222. In some embodiments, the grooves242 may comprise a single groove 242 configured in a substantiallyspiral pattern on the exterior surface of the element 240. The spiralgroove 242 may, for example, define a channel between the outer surfaceof the element 240 and the inner surface of the core 222 (e.g., alongthe surface of the cavity 226 of the core 222).

In some embodiments, the inlet 232 of the second end cap 230 may beoriented to direct fluid into the channel defined by the spiral groove242. The fluid may proceed, for example, through the channel along theinner surface of the core 222, progressing from the right side of thecavity 226 of the core 222 to the left side of the cavity 226 of thecore 222 (e.g., in accordance with the spiral channel defined by thespiral groove 242). According to some embodiments, the fluid maytransfer heat to the core 222 as it travels through the channel. Thegroove 242 may be configured, for example, to direct the fluid over alarge area of the inner surface of the core 222, to transfer asubstantial amount of heat to the core 222 (e.g., via conduction).

The fluid may, for example, be directed by the groove 242 (and/or thechannel defined thereby) to scrub a substantial amount of the innersurface of the core 222 to transfer a substantial amount of heat to thecore 222. In some embodiments, the element 240 and/or the groove 242 maybe configured to adjust the fluid flow properties within the cavity 226of the core 222. The groove 242 may be designed and/or configured, forexample, to establish certain properties of the channel defined by thegroove 242. The channel properties may, according to some embodiments,be configured and/or defined to cause the fluid flow to be eitherlaminar or turbulent, as is desirable and/or practicable fortransferring heat to the core 222. Turbulent fluid flow within thechannel may, for example, increase the convection of heat through and/orwithin the fluid, thereby increasing the efficiency of heat transfer tothe walls of the core 222.

In some embodiments, the groove 242 may terminate at and/or lead to theleft end of the element 240 and/or substantially at the left end of thecavity 226 of the core 222. The fluid may proceed, for example, from thegroove 242 and along the surface of the first end cap 228. In someembodiments, the fluid may be directed through a central portion of theelement 240 toward the outlet 234. The fluid may, for example, flowthrough a central conduit 244 extending from the left end of the element240 to the right end of the element 240. The central conduit 244 may,for example, transport cooled fluid (e.g., fluid that has transferredheat to the core 222) directly from the left end of the element 240and/or cavity 226 to the outlet 234. The conduit 244 may, for example,substantially prevent the cooled fluid from being re-heated by theheated fluid entering the cavity 226 from the inlet 232 by maintaining aseparation between the incoming and outgoing fluid flows.

In some embodiments, the heat exchanger 220 may also or alternativelycomprise a fluid path 246 that permits the cooled fluid to enter areservoir 248 (and/or that permits fluid from within the reservoir 248to exit the reservoir 248 and enter the central conduit 244). Thereservoir 248 may, for example, be a cavity defined by the element 240.According to some embodiments, the reservoir 248 may be disposed withinand/or defined by a vacant and/or void area in the central portion ofthe element 240. The central conduit 244 may, for example, pass throughthe reservoir 248. In some embodiments, the reservoir 248 may provide athermal mass (e.g., air, water, and/or another fluid) to reduce theimpact of large and/or severe thermal events. The reservoir 248 may, forexample, store a quantity of fluid to supply extra fluid to the heatexchanger 220 in the case that extra fluid is needed and/or to providethermal dampening as required. According to some embodiments, if fluidleaks from the heat exchanger 220 (e.g., due to old O-rings 236, 238and/or from seepage through hydroscopic plastic elements or components)over the life of the heat exchanger 220, for example, the extra fluid inthe reservoir 248 may replenish the lost amounts.

The replacement and/or augmentation of the fluid within the fluid pathsof the heat exchanger 220 may, for example, substantially prevent airbubbles from forming and/or being introduced into the fluid flow. Insome embodiments, the reservoir 248 may, for example, also oralternatively function as an air trap to collect air bubbles from thefluid flow. The reservoir 248 may, according to some embodiments,comprise one or more inserts and/or bladders (not shown). A foam element(not shown) may, for example, be disposed within the reservoir 248. Insome embodiments, the foam element may compress in the case that thefluid in the heat exchanger 220 expands to exert increased forces withinthe heat exchanger 220. If the fluid expands upon heating and/or due toother environmental factors, for example, the foam may absorb theincreased pressure in the heat exchanger 220 to substantially avoiddamage to any or all components associated with the fluid flow paths.

Referring now to FIG. 3, a perspective diagram of a heat exchanger 320according to some embodiments is shown. In some embodiments, the heatexchanger 320 may be similar to the heat exchangers 120, 220 describedin conjunction with any of FIG. 1 and/or FIG. 2. The heat exchanger 320may, for example, be configured to remove, transfer, and/or dissipateheat. The heat exchanger 320 may comprise, in some embodiments, a core322, fins 324, a cavity 326 defined by the core 322, a fist end cap 328,a second end cap 330, an inlet 332, an outlet 334, a first O-ring 336, asecond O-ring 338, an element 340, grooves 342 on the element 340, acentral conduit 344 within the element 340, and/or a reservoir 348.According to some embodiments, the components 320, 322, 324, 326, 328,330, 332, 334, 336, 338, 340, 342, 344, 348 of the system 300 may besimilar in configuration and/or functionality to the similarly-namedcomponents described in conjunction with FIG. 2. In some embodiments,fewer or more components than are shown in FIG. 3 may be included in thesystem 300.

In some embodiments, the heat exchanger 320 may comprise the core 322.As shown in FIG. 2, for example, the core 322 may comprise a hollowcylindrical form. In some embodiments, the heat exchanger 320 maycomprise one or more fins 324 extending outwardly from the core 322. Thefins 324 may be any configuration and/or type of heat-dissipating and/orradiating features that are or become known or practicable. As shown inFIG. 3, for example, the fins 324 may be Radial Curved Fin (RCF)protrusions from the core 322. The fins 324 may be configured, accordingto some embodiments, to place a substantial percentage or all of thesurface area of the fins 324 within the highest speed of airflowdirected from one or more fans (not shown in FIG. 3). The fins 324 mayalso, for example, be curved as shown to capture the swirl component ofany air directed by a fan toward the fins 324. The combination of thecore 322 and the fins 324 may, according to some embodiments, comprise asingle extrusion and/or other element. The core 322 and the fins 324may, for example, comprise a low-cost aluminum hollow form extrusion.

The core 322 may, according to some embodiments, define the cavity 326.The cavity 326 may, for example, be a cylindrical void disposed withinthe cylindrically-shaped core 322. In some embodiments, the cavity 326may reduce the weight and/or cost of the heat exchanger 320. Typicalheat exchangers, for example, may include solid cores that are expensiveand/or substantially increase the weight of typical cooling solutions.The heat exchanger 320 in FIG. 3, however, may be lighter and/or cheaperto produce than typical heat exchangers. At least by utilizing a fluidto transfer heat to the core 322, for example, the hollow core 322 maybe lighter and/or require substantially less material (e.g., aluminumand/or other metals) than typical heat exchangers. The use of the fluidto transfer heat to the core 322 may also or alternatively allow thediameter of the core 322 to be larger than in typical heat exchangers,which in turn allows the surface area of the core 322 and the fins 324to be larger, increasing the efficiency of heat transfer from the heatexchanger 320.

The heat exchanger 320 may, according to some embodiments, comprise thefirst end cap 328 and/or the second end cap 330. The end caps 328, 330may, for example, facilitate the retention, direction, transportation,and/or management of the fluid used to transfer heat to the core 322. Insome embodiments, the first end cap 328 may be coupled to a first end ofthe core 322 (e.g., the bottom end as oriented in FIG. 3) and/or thesecond end cap 330 may be coupled to a second end of the core 322 (e.g.,the upper end as oriented in FIG. 3). The end caps 328, 330 may, forexample, substantially prevent the fluid circulated within the cavity326 from leaking from the cavity 326 and/or may substantially preventair from entering the cavity 326.

In some embodiments, the second end cap 330 may comprise the inlet 332and/or the outlet 334. The second end cap 330 may function as a fluidmanifold, for example, directing fluid into the cavity 326 via the inlet332 and/or evacuating fluid from the cavity 326 via the outlet 324. Insome embodiments, one or more such manifolds may be included in the heatexchanger 320. According to some embodiments, the end caps 328, 330 maybe constructed of any material and/or in any manner that is or becomesknown or practicable. The end caps 328, 330 may, for example, becomprised of molded and/or extruded plastic. In some embodiments, theend caps 328, 330 may be coupled to the core 322 to form a hydraulicand/or hermetic seal that substantially prevents the fluid from leakingfrom the cavity 326 and/or that substantially prevents air from enteringthe cavity 326. Creation of the hydraulic and/or hermetic seal (and/orcoupling of the end caps 328, 330 to the core 322) may be facilitated,according to some embodiments, by utilizing one or more O-rings 326,328. The first O-ring 336 may be situated between the first end cap 328and the core 322 and/or the second O-ring 338 may be situated betweenthe second end cap 330 and the core 322. In some embodiments, othersealants, adhesives, fasteners, systems, devices, and/or methods may beused to couple and or seal the end caps 328, 330 to the core 322.

In some embodiments, the element 340 may be disposed within the cavity326. The element 340 may, for example, direct the flow of the fluidinside the cavity 326. According to some embodiments, the element 340may be shaped to fit inside the cavity 326. As shown in FIG. 3, theelement 340 may be substantially cylindrically shaped. In someembodiments, the element 340 may comprise one or more grooves 342(and/or other features) on the outside surface of the element 340. Theelement 340 may, for example, comprise a single groove 342 configured ina spiral pattern around the outside surface of the element 340. In thecase that the element 340 is inserted into the cavity 326, the groove342 may define one or more channels within which the fluid in the cavity326 may flow.

For example, the outer surface of the element 340, when inserted intothe cavity 326, may contact the inner surface of the core 322. In someembodiments, the areas of the outer surface of the element 340 that arebetween the paths of the groove 342 may substantially form seals betweenthe channels created by the groove 342. The fluid entering the cavity326 may, for example, be forced and/or directed in the space formedbetween the wall of the core 322 and the groove 342. According to someembodiments, other configurations of the groove 342 and/or the element340 may be utilized to direct the fluid as desired within the cavity326. In some embodiments, such as in the case that a spiral groove 342is utilized, the configuration of the element 340 and/or the groove 342may cause the fluid to pass over a large amount of the surface area ofthe inner wall of the core 322. This configuration may, for example,increase the amount of heat transferred from the fluid to the core 322.According to some embodiments, the element 340 may not be needed in theheat exchanger 320. The grooves 342 and/or other fluid directionfeatures may, for example, be included in the extrusion comprising thecore 322 and/or the fins 324. In some embodiments, the grooves 324 maybe cut and/or otherwise included in the inner wall of the core 322.

In some embodiments, the fluid, after having completed the spiral paththrough the cavity 326 (e.g., at the bottom end of the heat exchanger320 as shown in FIG. 3), may be directed into the central conduit 344 ofthe element 340. The central conduit 344 may, for example, be an outletpath that directs the cooled fluid to the outlet 334 of the second endcap 330. According to some embodiments, the reservoir 348 may separatethe central conduit 344 from the inner wall of the element 340 thatdefines the back of the channels used to transport the heated fluid. Insuch a manner, for example, the cooled fluid may be substantiallyprevented from being re-heated by the heated fluid entering the cavity326. This may, in some embodiments, increase the efficiency of thecooled fluid in collecting heat from any required and/or desired elementoutside of the heat exchanger 320. The heat exchanger 320 may, accordingto some embodiments, be utilized in any system and/or interfaced with orcoupled to any number, type, quantity, and/or configuration of pumps,reservoirs, cold plates, and/or other components. The heat exchanger 320may, for example, evacuate the cooled fluid to any type or configurationof pump that is or becomes known.

According to some embodiments, the reservoir 348 may also oralternatively store a reserve of fluid (e.g., to replenish fluid lost bythe heat exchanger 320 and/or other components associated with the fluidpaths) and/or provide thermal mass to dampen peak thermal eventsexperienced by the heat exchanger 320 and/or the fluid. In someembodiments, the reservoir 348 may comprise a foam element (not shown)that may be utilized to absorb and/or equalize pressure within the heatexchanger 320 and/or within the fluid paths generally. In someembodiments, the components 322, 324, 328, 330, 340 of the heatexchanger 320 may be coupled in any manner that is or becomes known orpracticable. As shown in FIG. 3, for example, the end caps 328, 330 maybe fastened to the core 322 and/or the fins 324 using the fasteners 382.The fasteners 382 may include, but are not limited to, rivets, screws,pins, adhesives, and/or any combination thereof. In some embodiments,the end caps 328, 330 may be molded directly onto the core 320 and/orthe fins 322 (e.g., onto the core 322 and fin 324 extrusion).

Turning now to FIG. 4, a cross-sectional diagram of a system 400according to some embodiments is shown. In some embodiments, the system400 may be configured to function with and/or may be otherwiseassociated with the system 100 and/or the heat exchangers 120, 220, 320described in conjunction with any of FIG. 1, FIG. 2, and/or FIG. 3. Thesystem 400 may comprise, for example, a cold plate 410 comprising acentral portion 412, fins 414, a radius 416, and/or a surface 418. Thesystem 400 may also or alternatively comprise a pump 450 comprising ahousing 452, an inlet 454, and/or an outlet 456. The pump 450 may alsoor alternatively comprise an impeller 460 comprising vanes 462. In someembodiments, the system 400 and/or the pump 450 may comprise a motor 470comprising one or more electromagnets 472, one or more magnets 474, arotor 476, and/or one or more bearings 478. According to someembodiments, the components 410, 450 of the system 400 may be similar inconfiguration and/or functionality to the similarly-named componentsdescribed in conjunction with FIG. 1. In some embodiments, fewer or morecomponents than are shown in FIG. 4 may be included in the system 400.

As shown in FIG. 4, the system 400 may comprise a combination cold plate410 and pump 450 (and/or motor 470). The cold plate 410 may, forexample, be integrated into the pump 450. In some embodiments, the coldplate 410 may be configured not only to transfer heat to the fluid inthe pump 450, but also to facilitate the direction of the fluid insidethe pump housing 452. For example, the cold plate 410 may comprise acentral portion 412. In some embodiments, the central portion 412 of thecold plate 410 may be the hottest portion of the cold plate 410. Anelectrical component (not shown in FIG. 4) may, for example, transfermore heat to the center of the cold plate 410 than to other portions ofthe cold plate. In some embodiments, the fluid entering the pump 450 viathe inlet 454 may be initially directed to the central portion 412 ofthe cold plate 410. The central portion 412 may, as shown in FIG. 4, forexample, be extended upward and/or into the fluid path.

The cold plate 414 may, for example, comprise one or more fins 414. Thefins 414, according to some embodiments, may be taller near the centralportion 412 of the cold plate, and may decrease in height and/or size asthe radius of the cold plate 410 increases. In such a manner, forexample, the fluid may be in greater contact with the hottest portions(e.g., the central portion 412) of the cold plate 410, increasing theefficiency of the heat transfer from the cold plate 410 to the fluid.According to some embodiments, the fins 414 and/or the central portion412 of the cold plate 410 may be configured to direct the fluid in aradial fashion outward from the central portion 412 of the cold plate410 to the extremities of the cold plate 410. In such a manner, forexample, a cross-flow of heat exchange may be accomplished by directingthe coldest fluid (e.g., the fluid entering the inlet 454) over thehottest portions (e.g., the central portion 412) of the cold plate 412,while the increasingly heated fluid travels over increasingly coolerportions of the cold plate 410. This cross-flow heat exchange may,according to some embodiments, achieve high efficiencies of heattransfer between the cold plate 410 and the fluid.

In some embodiments, the cold plate 410 may also or alternativelyfunction as a flow inducer for the impeller 460. The fins 414 of thecold plate 410 may, for example, be curved and/or otherwise configuredto direct the fluid entering from the inlet 454 to the vanes 462 of theimpeller 460. The fins 414 may, according to some embodiments, directthe incoming fluid in such a manner so as to increase the efficiency ofingestion of the fluid by the impeller 460. In other words, thedirection of the fluid by the fins 414 of the cold plate 410 may reducefriction losses in the fluid flow and/or substantially preventcavitation and/or other flow disruptions. In some embodiments, thecurved nature of the fins 414 may also or alternatively increase theefficiency of heat transfer from the fins 414 to the fluid. The fluidmay be scrubbed across the fins 414, for example, as the fluid is forcedto change direction by the curved fins 414.

The fins 414 of the cold plate 410 may, according to some embodiments,extend from the central portion 412 of the cold plate 410 to a radius416 of the cold plate 410. The fins 414 may terminate at the radius 416,for example, to provide the surface 418 on the cold plate 410. Thesurface 418 may, according to some embodiments, provide an area throughwhich the vanes 462 of the impeller 460 may travel. The vanes 462 of theimpeller 460 may, for example, travel around the radius 416 of the coldplate 410 (e.g., around the fins 414 and/or on the surface 418). Thevanes 462 may, according to some embodiments, direct the fluid receivedfrom the fins 414 to the outlet 456. In some embodiments, the inlet 454and/or the outlet 456 may be defined and/or formed by the pump housing452. According to some embodiments, the cold plate 410 may be coupled tothe pump housing 452. The cold plate 410 may, for example, be coupled tothe pump housing 452 to create a hydraulic and/or hermetic seal tosubstantially prevent the fluid from leaking from the pump housing 452and/or to substantially prevent air from entering the pump housing 452.In some embodiments, the seal between the cold plate 410 and the pumphousing 452 may comprise an O-ring (not shown in FIG. 4) and/or othersealant or fastener.

According to some embodiments, the inlet 454 may receive fluid fromanother device and/or component. The fluid may, for example, be cooledfluid received from a reservoir (e.g., the reservoir 148, 248, 348)and/or from a heat exchanger such as the heat exchangers 120, 220, 320described herein. The fluid may, according to some embodiments, beheated by the cold plate 410 and directed by the cold plate 410 and/orthe impeller 460 toward the outlet 456. The outlet 456 may, for example,direct the heated fluid to another device or component such as to a heatexchanger (e.g., the heat exchanger 120, 220, 320). In such a manner,for example, the system 400 and/or the pump 450 may circulate the fluidto operate a cooling cycle to remove heat from the cold plate 410(and/or from an electric component coupled thereto).

In some embodiments, the system 400 may also or alternatively comprisethe motor 470. The motor 470 may, for example, power the impeller 460 todirect the fluid toward the outlet 456. According to some embodiments,any type and/or configuration of motor that is or becomes known may beutilized to provide power to the impeller 460. As shown in FIG. 4, forexample, the motor 470 may be or include a brushless motor such as abrushless Direct Current (DC) motor. The motor 470 may comprise, forexample, one or more electromagnets 472 (and/or electromagnetic coils),one or more magnets 474 (e.g. permanent magnets), and/or a rotor 476. Insome embodiments, the magnets 474 may be coupled to the rotor 476 (e.g.,as is typical in brushless DC motors). According to some embodiments,one or more bearings 478 may be utilized to reduce friction and/orfacilitate motion of the rotor 476.

As shown in FIG. 4, the motor 470 may be integrated into the pump 450.The rotor 476 (and the magnets 474 coupled thereto) may, for example,rotate within the pump housing 452. The bearings 478 may, according tosome embodiments, facilitate the rotation of the rotor 476 within thepump housing 452. In some embodiments, some of the components 472, 474,476 of the motor 470 may be separated by a wall of the pump housing 452.As shown in FIG. 4, for example, the rotor 476 and the magnets 474 maybe disposed within the pump housing 452 (e.g., exposed to the fluid),while the electromagnets 472 may be disposed and/or coupled to theoutside of the pump housing 452 (e.g., not exposed to the fluid). Themagnetic and/or electromagnetic forces required to operate the motor 470may, for example, pass through the wall of the pump housing 452 topermit the motor 470 to be integrated into the pump 450.

In some embodiments, integrating the motor 470 into the pump 450 mayeliminate the need for a shaft (e.g., to power the impeller) and/or mayeliminate the need for dynamic hydraulic and/or hermetic seals (e.g.,that would typically be required surrounding a powered shaft protrudingfrom the pump housing 452). The impeller 460 may, for example, bedisposed upon and/or coupled to the rotor 476. As shown in FIG. 4, forexample, the vanes 462 of the impeller 460 may be disposed on the bottomportion of the rotor 476 that rotates over the surface 418 of the coldplate 410. According to some embodiments, integrating the motor 470 intothe pump 450 may reduce the potential for wear, leaking, and/or otherproblems associated with the pump 450.

The only non-fluid path seal that may be required in the system 400, forexample, may be the seal between the cold plate 410 and the pump housing452. The integrated motor 470 may be brushless and/or may not require ashaft penetrating the pump housing 452. Incorporating the rotor 476and/or the magnets 474 into the fluid within the pump housing 452 mayalso or alternatively, according to some embodiments, create ahydroscopic bearing effect that may reduce the wear on various system400 components (such as the bearings 478, the rotor 476, and/or the pumphousing 452 itself). In some embodiments, the integrated motor 470 mayalso or alternatively allow the diameter of the impeller 460 and/orrotor 476 to be larger than in typical pumps and/or motors. The largerdiameter impeller 460 and/or rotor 476 may, for example, allow the motorto spin at lower Revolutions Per Minute (RPM) than typical motors, whileproducing higher torque, flow, and/or pressure.

Referring to FIG. 5, a perspective diagram of a cold plate 510 accordingto some embodiments is shown. In some embodiments, the cold plate 510may be similar to the cold plates 110, 410 described in conjunction withany of FIG. 1 and/or FIG. 4. The cold plate 510 may comprise, forexample, a central portion 512, one or more fins 514, a radius 516,and/or a surface 518. According to some embodiments, the components 512,514, 516, 518 of the system 500 may be similar in configuration and/orfunctionality to the similarly-named components described in conjunctionwith FIG. 4. In some embodiments, fewer or more components than areshown in FIG. 5 may be included in the system 500.

The cold plate 510 may, according to some embodiments, be or include adisk and/or other circular configuration. As shown in FIG. 5, forexample, the cold plate 510 may be a finned-disk (e.g., comprising thefins 514). In some embodiments, the cold plate 510 may be comprised ofcopper and/or another thermally conductive material. The cold plate 510may, for example, be a finned copper disk. According to someembodiments, the cold plate 510 may be manufactured using a MetalInjection Molding (MIM) process or various forging techniques. The coldplate 510 may, in some embodiments, also or alternatively be shapedand/or otherwise configured to fit inside and/or otherwise be integratedwith a pump such as the pump 450.

According to some embodiments, the cold plate 510 may be an IntegratedHeat Spreader (IHS) coupled to an electronic device and/or electricalcomponent (not shown in FIG. 5). The cold plate 510 may, for example,receive heat from the electronic device (e.g., coupled to the undersideof the cold plate 510). According to some embodiments, adhesive and/orthermal grease and/or other thermal interface material may be appliedbetween the electronic device and the cold plate 510 to facilitate heattransfer and/or coupling. In some embodiments, a fluid may also oralternatively be passed over and/or through the cold plate 510 to removeheat from the cold plate 510.

In some embodiments, the central portion 512 of the cold plate 510 maybe the hottest portion of the cold plate 510 (e.g., the temperature ofthe cold plate 510 may decrease as the radius increases). This may bedue at least in part, for example, to the concentration of heat from theelectronic device toward the central portion 512 of the cold plate 510.The fins 514 of the cold plate 510 may, according to some embodiments,be configured to efficiently remove and/or dissipate heat from the coldplate 510. The fins 514 may, as shown in FIG. 5 for example, be tallernear the central portion 512 of the cold plate 510 and decrease inheight, size, and/or surface area as the radius of the cold plate 510increases. The fins 514 may also or alternatively increase in number(e.g., as shown in FIG. 5) as the radius of the cold plate 510increases. The number and/or size of the fins 514 may be designed and/orcontrolled, according to some embodiments, to manage the cross-sectionalarea of the cold plate 510 as a function of the radius of the cold plate510. The ratio may be maintained at a substantially constant value, forexample, to increase the efficiency with which the cold plate 510 maytransfer heat to the fluid.

The fins 514 of the cold plate 510 may also or alternatively be curved,as shown in FIG. 5, for example. The orientation of the fins 514 may,according to some embodiments, cause the fluid directed toward the coldplate 510 to be directed in a radial fashion toward the radius 516 ofthe cold plate 510. The fins 514 may, for example, terminate at theradius 516 so that an impeller (e.g., the impeller 460) may rotatearound the fins 514. The surface 518 situated between the radius 516 andthe edge of the cold plate 510 may, for example, be used to rotate thevanes of an impeller around the fins 514. The curvature of the fins 514may, according to some embodiments, direct the fluid toward the vanes ofthe impeller, increasing the efficiency of the fluid flow through theimpeller.

Turning now to FIG. 6, a perspective diagram of an impeller 660according to some embodiments is shown. In some embodiments, theimpeller 660 may be similar to the impeller 460 described in conjunctionwith FIG. 4. The impeller 660 may comprise, for example, one or morevanes 662, a shaft portion 664, and/or a bottom edge 666. In someembodiments, the impeller 660 may also or alternatively define a cavity668. According to some embodiments, the components 662 of the system 600may be similar in configuration and/or functionality to thesimilarly-named components described in conjunction with FIG. 4. In someembodiments, fewer or more components than are shown in FIG. 6 may beincluded in the system 600.

According to some embodiments, the perspective diagram of the impeller660 may be a view of the bottom of the impeller 660. The bottom edge 666of the impeller 660 may, for example, be configured to travel along thesurface 418, 518 of the cold plate 410, 510. In some embodiments, theshaft portion 664 of the impeller 660 may also or alternatively be orinclude the rotor 476 of the motor 470. The impeller 660 may, forexample, fit within the pump housing 452, with the cold plate 410fitting in the cavity 668 defined by the impeller 660. In someembodiments for example, a fluid used to transfer heat from a cold platemay travel up through the cavity 668 toward the vanes 662. The fluidmay, for example, be directed and/or induced to flow toward the vanes662 by various fins (e.g., fins 414, 514) of the cold plate.

According to some embodiments, the impeller 660 may spin around the coldplate, receiving the fluid and directing the fluid toward one or moreparticular points. The fluid may be directed, for example, toward anoutlet such as the outlet 456 defined by the pump housing 452. In someembodiments, the vanes 662 may be curved (as shown in FIG. 6). Thecurvature of the vanes 662 may, according to some embodiments, besimilar to and/or otherwise associated with a curvature of the fins ofthe cold plate (not shown in FIG. 6) disposed within the cavity 668. Theimpeller 660 and/or the vanes 662 may be comprised of any materials thatare or become known or practicable.

Referring now to FIG. 7, a cross-sectional diagram of a cooling system700 according to some embodiments is shown. In some embodiments, thecooling system 700 may be similar to the system 100 described inconjunction with FIG. 1. The cooling system 700 may comprise, forexample, a cold plate 710 comprising a central portion 712, and/or oneor more fins 714, and/or a heat exchanger 720 comprising a core 722, oneor more fins 724, and/or end caps 728, 730. The second end cap 730 may,according to some embodiments, comprise and/or define and inlet 732and/or an outlet 734. In some embodiments, the heat exchanger may alsoor alternatively comprise an element 740 to direct fluid within the heatexchanger and/or a reservoir 748. In some embodiments, the coolingsystem 700 may comprise a pump 750 comprising a pump housing 752, aninlet 754, and/or an outlet 756.

According to some embodiments, the pump 750 may comprise an impeller 760and/or be integrated with a motor 770. The motor 770 may comprise anelectromagnet 772, a permanent magnet 774, and/or a rotor 776. Thecooling system 700 may also or alternatively comprise a fan 780 and/or acooling solution space 790. According to some embodiments, thecomponents 710, 712, 714, 720, 722, 724, 728, 730, 732, 734, 740, 748,750, 752, 754, 756, 760, 770, 772, 774, 776, 780 of the cooling system700 may be similar in configuration and/or functionality to thesimilarly-named components described in conjunction with any of FIG. 1,FIG. 2, FIG. 3, FIG. 4, FIG. 5, and/or FIG. 6. In some embodiments,fewer or more components than are shown in FIG. 7 may be included in thecooling system 700.

The cooling system 700 may, according to some embodiments, be or includea cooling solution. The cooling system 700 may, for example, comprise acooling solution for an electronic device such as a PC or computerserver. In some embodiments, the cooling system 700 may comprisemultiple components that are coupled and/or otherwise in communicationto remove, move, and/or dissipate heat. The cooling system 700 maycomprise, for example, the cold plate 710 to receive heat from a source(e.g., an electronic component). A fluid may, according to someembodiments, flow over and/or through the cold plate 710 to remove heatfrom the cold plate 710. In some embodiments, the cold plate 710 maycomprise a central portion 712 from which fins 714 of decreasing sizemay extend along the cold plate 710. The fins 714 may, for example,facilitate the transfer of heat from the cold plate 710 to the fluidand/or may induce the fluid to flow in one or more particulardirections.

The cooling system 700 may also comprise the pump 750, which may, forexample, be integrated with the cold plate 710 (e.g., the cold plate 710may be at least partially disposed within the pump housing 752). Thepump 750 may, in some embodiments, cause the fluid to circulate withinthe system 700. The heated fluid from the cold plate 710 may, forexample, be directed by the fins 714 of the cold plate 710 to theimpeller 760 of the pump 750. The impeller 760 may, according to someembodiments, be powered by the motor 770. In some embodiments, the motor770 may also or alternatively be integrated with the pump 750. Theelectromagnets 772 of the motor 770 may be disposed and/or coupled tothe outside of the pump housing 752, for example, while the rotor 776and/or the permanent magnets 774 of the motor 770 may be disposed and/orcoupled inside of the pump housing 752. The motor 770 may, according tosome embodiments, cause the impeller 760 to rotate and direct the fluidtoward the outlet 756 defined by the pump housing 752.

The heated fluid may, for example, be directed via the outlet 756 to theinlet 732 of the heat exchanger 720 (and/or of the second end cap 730).In some embodiments, the heat exchanger 720 may remove heat from thefluid and/or radiate the heat (and/or conduct the heat) into theenvironment within and/or around the cooling system 700. The heatexchanger 720 may, according to some embodiments, comprise the core 722and/or fins 724 emanating from the core 722. The fins 724 may, forexample, conduct heat from the core 722 and radiate (and/or conduct) theheat into the area around, between, and/or near the fins 724. In someembodiments, the fan 780 may facilitate the removal of heat from thefins 724 by blowing and/or directing air over, between, and/or towardthe fins 724. In some embodiments, the fins 724 may be emanate in aradial fashion from a cylindrically-shaped core 722 to efficientlyutilize the air flow provided by the fan 780.

According to some embodiments, the heat exchanger 720 may also oralternatively comprise the end caps 728, 730 to retain fluid within theheat exchanger 720 and/or the element 740 disposed within the heatexchanger 720 to direct fluid within the heat exchanger 720. The element740 may, for example, be configured to increase the amount of surfacearea that the fluid passes over within the core 722. The element 740 maydefine one or more paths or channels, according to some embodiments,that direct the fluid along the walls of the core 722. The paths may belengthy to increase the amount of time and/or surface area that thefluid may scrub the walls to transfer heat to the core 722. The pathsmay comprise, for example, a spiral path along the inner wall of thecore 722. In some embodiments, the heat exchanger 720 and/or the coolingsystem 700 may also or alternatively comprise the reservoir 748 toprovide, receive, and/or store fluid for the cooling system 700. Thecooled fluid exiting the heat exchanger 720 may, for example, be storedin the reservoir 748.

In some embodiments, the cooled fluid may exit the heat exchanger viathe outlet 734. The outlet 734 may, for example, be coupled to and/orotherwise associated with the inlet 754 of the pump 750. In such amanner, for example, the cooled fluid may be directed back to the coldplate 710 within the pump housing 752. In some embodiments, the cooledfluid may receive heat from the cold plate 710 and be directed by theimpeller 760 back to the heat exchanger 720 to remove heat from thefluid. This cooling loop may, according to some embodiments,substantially continuously (and/or as needed) remove heat from anelectrical component (not shown in FIG. 7). In some embodiments, thefluid circulated within the cooling system 700 may be or include anyfluid that is or becomes practicable for transferring heat. In someembodiments, the fluid may be substantially comprised of water.According to some embodiments, the fluid may be a combination of fluidssuch as a combination of water and propylene glycol. The propyleneglycol may be utilized at about thirty-five percent by volume, accordingto some embodiments, to substantially mitigate environmental effectssuch as freezing that the cooling system 700 may encounter (e.g., duringshipping).

The cooling system 700 may, in some embodiments, be configured to fitwithin the cooling solution space 790. The cooling solution space 790may, for example, be an area and/or volume within an electrical deviceor component that is available for placement and/or mounting of acooling solution. In some embodiments, the cooling solution space 790may, for example, be or include a cooling solution space within a deviceconfigured in accordance with the Balanced Technology eXtended (BTX)Interface Specification Version 1.0a (February 2004) published by Intel®Corporation. According to some embodiments, the cooling system 700 mayfit within the cooling solution space 790 and provide room within thecooling solution space 790 to allow the airflow from the fan 780 todissipate and/or transport heated air removed from the fins 724 of theheat exchanger 720. In some embodiments, one or more of the components710, 720, 750, 770, 780 of the cooling system 700 may be configured tofit within the cooling solution space 790. As shown in FIG. 7, forexample, the one or more of the fins 724 (and/or portions thereof) maybe altered to fit within the cooling solution space 790.

In some embodiments, the cooling system 700 may provide many advantagesover typical cooling solutions. The integration of multiple components(e.g., the pump 750, the cold plate 710, and/or the motor 770) and/orthe configuration that closely couples the heat exchanger 720 to thepump 750 may, for example, substantially reduce the space required forthe cooling system 700. In some embodiments, reducing the required spacemay also reduce the amount of interference with the airflow from the fan780, increasing the efficiency of the cooling system 700. In the casethat the fins 724 of the heat exchanger 720 emanate in a radial fashionfrom the core 722, the cooling system 700 may also or alternativelyprovide highly efficient use of the airflow from the fan 780 bypositioning a large percentage of the area of the fins 724 directlywithin the streamlines created by the fan 780.

According to some embodiments, the obstruction to airflow within thecooling system 700 may be further reduced by the configuration thatplaces the fluid management components (728, 730, 732, 734, 740, 748) inthe shadow of the hub of the fan 780. In other words, the fluidmanagement components may, as shown in FIG. 7, be positioned behind acentral portion of the fan 780, which may typically be the fan hub,which produces minimal or no airflow. In the case that the components710, 720, 750, 770, 780 of the cooling system are configured as describein some embodiments herein, the cooling system may also or alternativelybe substantially lighter and/or cheaper to manufacture than typicalcooling solutions. In the case that the heat exchanger 720 comprises alow-cost aluminum extrusion and/or a hollow core 722, for example, theamount of metal and/or mass required for heat dissipation may besubstantially reduced. Similarly, utilizing plastic to form the end caps728, 730 and/or the element 740 may further reduce the weight and/orcost of the cooling system 700.

In some embodiments, the close coupling and/or orientations of thecomponents 710, 720, 750, 770, 780 of the cooling system 700 may also oralternatively increase the reliability of the cooling system 700. Theclose coupling of the components 710, 720, 750, 770, 780 shown in FIG.7, for example, may substantially reduce the distance and/or areathrough which fluid may be lost to leakage (e.g., through hydroscopicplastic elements). The inlet 732 and the outlet 734 of the heatexchanger may, for example, be substantially the only areas of plasticfluid path via which fluid may seep. Typical systems include much longerfluid path lengths in contact with externally exposed plastic areas. Nohoses and/or tubes may be necessary in the cooling system 700, forexample. The reliability of the cooling system 700 may also oralternatively be increased by the integration of the pump 750 and thecold plate 710 and/or the motor 770. The integration may, for example,reduce the number of dynamic seals and/or wear surfaces within the pump750, increasing the reliability of the pump 750. The motor 770 itselfmay also, for example, lack any substantially wearable parts orcomponents (e.g., brushes).

Turning to FIG. 8, a block diagram of a system 800 according to someembodiments is shown. In some embodiments, the system 800 may be similarto the systems 100, 700 described in conjunction with any of FIG. 1and/or FIG. 7. The system 800 may comprise, for example, a processor802, a cold plate 810, a heat exchanger 820, a reservoir 848, a pump850, a motor 870, a fan 880, and/or a memory 892. According to someembodiments, the components 802, 810, 820, 848, 850, 870, 880 of thesystem 800 may be similar in configuration and/or functionality to thesimilarly-named components described in conjunction with any of FIG. 1,FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, and/or FIG. 7. In someembodiments, fewer or more components than are shown in FIG. 8 may beincluded in the system 800.

The processor 802 may be or include any number of processors, which maybe any type or configuration of processor, microprocessor, and/ormicro-engine that is or becomes known or available. In some embodiments,other electronic and/or electrical devices may be utilized in place ofor in addition to the processor 802. The processor 802 may, for example,be or include any device, object, and/or component that generates,stores, and/or requires removal of heat. According to some embodiments,the processor 802 may be an XScale® Processor such as an Intel® PXA270XScale® processor. The memory 892 may be or include, according to someembodiments, one or more magnetic storage devices, such as hard disks,one or more optical storage devices, and/or solid state storage. Thememory 892 may store, for example, applications, programs, procedures,and/or modules that store instructions to be executed by the processor802. The memory 892 may comprise, according to some embodiments, anytype of memory for storing data, such as a Single Data Rate RandomAccess Memory (SDR-RAM), a Double Data Rate Random Access Memory(DDR-RAM), or a Programmable Read Only Memory (PROM).

In some embodiments, the cold plate 810 may be an IHS coupled to theprocessor 802. The cold plate 810 may, for example, remove and/orreceive heat (e.g., via conduction) from the processor 802 (e.g.,represented by the wavy lines in FIG. 8). According to some embodiments,such as shown in FIG. 8 for example, the cold plate 810 may beintegrated with the pump 850. The cold plate 810 may, for example,transfer heat to a fluid in the pump 850 and/or facilitate the flow ofthe fluid within the pump 850 as described herein. In some embodiments,the motor 870 may also or alternatively be integrated with the pump 850.The motor 870 may, for example, include components disposed within thepump 850 and/or components disposed outside of the pump 850. In someembodiments, the motor 870 may power the pump 850 to direct the fluid(e.g., the heated fluid) to the heat exchanger 820. The heat exchanger820 may then, for example, transfer and/or receive heat from the fluidand dissipate and/or remove the heat from and/or within the system 800.The fan 880 may, in some embodiments, facilitate the removal and/ordissipation of heat by blowing air toward the heat exchanger 820.According to some embodiments, the reservoir 848 to store the fluid(and/or a portion thereof) may be integrated with the heat exchanger820. The fluid (e.g., the cooled fluid) may, for example, be directedfrom the heat exchanger 820 into the reservoir 848. According to someembodiments, the cooled fluid may be sent back to the pump 850 (and/orpump 850, motor 870, cold plate 810 combination) to continue the coolingcycle.

In some embodiments, any or all of the cooling components 810, 820, 848,850, 870, 880 may be or include components similar to those describedherein. According to some embodiments, one or all of the coolingcomponents 810, 820, 848, 850, 870, 880 may also or alternativelycomprise one or more conventional devices to perform the requiredfunctionality of the particular component. As an example, the heatexchanger 820 may, in some embodiments, be a typical heat sink and/orheat pipe. The pump 850 may also or alternatively, for example, be atypical centrifugal pump powered by a standard DC motor (e.g., coupledby a shaft to the pump 850).

The several embodiments described herein are solely for the purpose ofillustration. Other embodiments may be practiced with modifications andalterations limited only by the claims.

1. A system, comprising: a heat exchanger comprising: a core defining a cavity, wherein the cavity extends substantially from a first end of the core to a second end of the core; a plurality of fins extending outwardly from the core, wherein each fin is a radial curved fin and includes a first end and a second end, and wherein the first end is coupled to the core and the second end is detached; an element disposed within the cavity of the core, wherein the element is to direct fluid within the cavity; a first cap coupled to the first end of the core, wherein the first cap is to retain the fluid within the cavity; and a second cap coupled to the second end of the core, wherein the second cap comprises an inlet and an outlet.
 2. (canceled)
 3. (canceled)
 4. The system of claim 1, further comprising: a seal disposed between the first cap and the first end of the core.
 5. (canceled)
 6. The system of claim 1, further comprising: a seal disposed between the second cap and the second end of the core.
 7. The system of claim 1, wherein at least one of the core or the element define one or more channels to direct the fluid within the cavity.
 8. The system of claim 1, wherein the element comprises an exterior surface that contacts an interior surface of the cavity, and wherein the exterior surface of the element comprises at least one groove.
 9. The system of claim 8, wherein the at least one groove defines at least one channel between the exterior surface of the element and the interior surface of the cavity, and wherein the at least one channel is to direct the fluid.
 10. The system of claim 9, wherein the at least one channel is oriented in a substantially spiral configuration.
 11. The system of claim 1, further comprising: a reservoir disposed within a central portion of the cavity.
 12. The system of claim 11, wherein the reservoir is defined by the element.
 13. The system of claim 11, wherein the reservoir is hydraulically coupled to a path extending through the central portion of the cavity.
 14. The system of claim 11, further comprising: a foam element disposed within the reservoir, wherein the foam element is to compress in the case that the fluid expands to apply force to the foam.
 15. The system of claim 1, wherein the core is substantially cylindrical and the fins extend in a radial fashion from the core.
 16. (canceled)
 17. The system of claim 1, wherein the core is comprised substantially of extruded aluminum.
 18. The system of claim 1, wherein the element is a shaped element comprised substantially of plastic.
 19. The system of claim 1, wherein the fluid is to transfer heat to the core.
 20. The system of claim 1, wherein the fluid is substantially water.
 21. The system of claim 1, wherein the fluid is comprised substantially of water and propylene glycol.
 22. A system, comprising: a heat exchanger comprising: a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends; a plurality of fins extending outwardly from the core between the first and second ends, wherein each fin is a radial curved fin and includes a first end and a second end, and wherein the first end is coupled to the core and the second end is detached; an inlet to accept a fluid; an outlet to evacuate the fluid; a shaped element disposed within the cavity of the core, wherein the shaped element is to direct fluid within the cavity; a first cap coupled to the first end of the core, wherein the first cap is to retain the fluid within the cavity; and a second cap coupled to the second end of the core, wherein the second cap comprises the inlet and the outlet; a pump to move the fluid; a cold plate to transfer heat to the fluid; a processor coupled to the cold plate; and a double data rate memory coupled to the processor.
 23. The system of claim 22, wherein at least one of the core or the shaped element define one or more channels to direct the fluid within the cavity.
 24. The system of claim 23, wherein the one or more channels are oriented in a substantially spiral configuration. 